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Opis produktu
Solder Joint Technology - King-Ning Tu
The European Union's directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.
Szczegóły
Solder Joint Technology
Springer Series in Materials Science
wrzesień 2007
Springer-Verlag GmbH
0387388907
9780387388908
242 x 159 x 24
King-Ning Tu
Springer Series in Materials Science
wrzesień 2007
Springer-Verlag GmbH
0387388907
9780387388908
242 x 159 x 24
